This is a LCFlex application of our substrates products. Substrates allow for two memory devices to be placed on a singe pad location on a memory module. This is called Stacked Memory. Can be DRAM, SRAM, or FLASH memory in either BGA or even DIE.
	LCFlex example of our patented Technology applied to a Rambus application. Used in memory applications.
	Stacked memory where two memory devices can be attached by our substrate and placed onto a single memory pad location.
	End view of the Stacked Memory device showing the LCFlex substrate attaching the two memory devices in a single pad location on a board. This allows the capacity of the memory module to be doubled.
	Stacked memory module utilizing the ChipStack patented LCFlex technology to produce.