Substrate

This LCFlex application represents the capability of LCFlex ( low cost flexible) as it has three flex layers between the two solid rigid boards.
 
 
 

LCFlex technology utilizing high ductile copper in our patented rigid-flex board applications.
 
 
   

Copper Foil used as a core material in our LCFlex patented technology in lieu of foreign materials like Polyimide.