OUR MISSION is to provide innovative technology solutions to our OEM customers so they can insert increased electronics and high technology sub-systems into smaller spaces. ChipStack MPM’s enable System Engineers an option to fulfill their need for ever increasing technology requirements while minimizing package volume with a simple, low cost option with maximum flexibility.

Remember, the LCflex technology allows you to fold over the rigid PCB designs into a smaller envelope and still maintain the SI and speed of a standard rigid board.

All at a lower price with none of the issues compared to a Polyimide design in a smaller space.

We have design teams, Board Houses and CM’s ready to support your idea’s and designs.

Call us today.